"AMD Instinct MI200 accelerators deliver breakthrough performance in HPC and AI, helping scientists make generational leaps in research that can dramatically shorten the time from initial hypothesis to discovery. With key innovations in architecture, packaging and system design, the AMD Instinct MI200 series accelerators are the most advanced data center GPUs ever created, delivering exceptional performance to supercomputers and data centers to solve the world's most complex problems."
Frontier Supercomputer
AMD collaborated with the U.S. Department of Energy, Oak Ridge National Laboratory and HPE to design the Frontier supercomputer, which is expected to deliver more than 1.5 exaflops of peak computing power. Powered by optimized third-generation AMD EPYC™ processors and AMD Instinct MI250X accelerators, Frontier is expected to push the boundaries of scientific discovery by dramatically improving the performance of large-scale AI, analysis and simulation. It will enable scientists to perform more computations, identify new data patterns, and develop innovative data analysis methods that drive scientific discovery. Thomas Zacharia, Director, Oak Ridge National Laboratory said:"The Frontier supercomputer is the culmination of a strong collaboration between AMD, HPE and the U.S. Department of Energy to deliver an exascale-capable system that pushes the boundaries of scientific discovery by dramatically improving the performance of large-scale artificial intelligence, analysis and simulation."The AMD Instinct MI200 series accelerators, coupled with third-generation AMD EPYC processors and the ROCm™ 5.0 open software platform, are designed to propel new discoveries for the exascale era and address the most pressing challenges, from climate change to vaccine research. Key capabilities and features of AMD Instinct MI200 accelerators include:
- AMD CDNA™ 2 Architecture - Second generation matrix cores accelerating FP64 and FP32 matrix operations, delivering up to 4 times the maximum theoretical performance of FP64 over previous generation AMD GPUs. 1,3,4
- Industry-leadingpackaging technology - Industry's first multi-dies GPU design with 2.5D Elevated Fanout Bridge (EFB) technology offering 1.8 times more cores and 2.7 times more memory bandwidth compared to the previous generation AMD GPU, delivering the industry's best aggregate peak theoretical memory bandwidth at 3.2 terabytes per second. 4,5,6
- AMD Infinity Fabric™ third-generation technology: up to 8 Infinity Fabric links connect the AMD Instinct MI200 with third-generation EPYC processors and other GPUs in the node to enable unified CPU/GPU memory coherency and maximize system throughput, enabling easier ramping of CPU code to harness the power of accelerators.
Our articles will then appear first in Google Top Stories.